As a member of the DPSS technology family, uv-lasing UV laser, using triple frequency (THG) technology, and inherits the excellent quality of Lase family.Compared with the 1064mm infrared laser, 355mm uv light can greatly reduce the material deformation and greatly reduce the thermal impact area.
Due to its high average power and high repetition rate, this laser is very suitable for the complicated graphic cutting of silicon wafer and the high-speed cutting of glass material.
Like the Lase series, the uv laser also USES air-cooled technology and can be easily integrated into production lines.
The high performance of the laser source can meet the requirements of high level material processing which can not meet the ordinary laser source.